Brontek to present at IIT-2008, Monterey, CA, USA
Brontek will present a paper describing its unique cathodic arc process for shallow junction doping of boron for semiconductor logic circuits at the 17th International Conference on Ion Implantation Technology (IIT 2008, June 8-13). This biennial conference is the premier world venue for the presentation of the latest advances in all aspects of ion implantation, from the fundamentals of ion-solid interactions to manufacturing applications of the latest machines and systems. The emphasis has traditionally been on semiconductor technology, but other applications for ion implantation, such as treatment of orthopedics devices are often presented as well.
Possible solutions for the “shallow junction doping problem” have been a focus of the industry for some years, and such research will again be a major focus of the Conference this year. The Brontek paper, entitled,
Shallow Junction and Ultra-Shallow Junction Doping by Means of the Cathodic Arc Plasma Generation Technology
was authored by a team from Brontek and HY-Tech Research Corporation, also of Radford, VA. The paper will be presented by Brontek’s Jim Williams at 10:00 AM on Thursday, June 12.